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For inspection in tight spaces, the factory-installed hand strap provides maximum comfort while maintaining access to the most critical functions. The ergonomic design of the BondMaster 600 is convenient for difficult-to-access inspection locations. Improved mechanical impedance analysis (MIA) method. The BondMaster 600 bond tester is programmed for a range of standard inspection methods, including pitch-catch RF, pitch-catch impulse, pitch-catch swept, resonance, as well as a notably Activated by the simple touch of a key, the full-screen mode is always accessible regardless of the display mode or inspection method you are using. The resolution and brightness of the 5.7-inch VGA screen on the BondMaster 600 handheld bond tester becomes even more apparent when switched into full-screen mode. Workflow of the BondMaster 600 offers archiving and reporting that are accessible to any level of user. The enhanced user interface and simplified Whether you are inspecting honeycomb composite, metal-to-metal bonds, or laminate composite, the BondMaster 600 offers exceptional ease-of-use thanks to its direct-access keys and streamlined interface that features convenient presets for common applications.
MODE 6 SCAN MASTER SOFTWARE
The BondMaster® 600 delivers a powerful combination of multiple mode bond testing software and highly advanced digital electronics, providing consistently crisp and high-quality signals. High Performance through Intuitive Operation OEM Microscope Components for Integration.Semiconductor & Flat Panel Display Inspection Microscopes ▾.Automated Detection Technology Software.Aerospace/Wind Blade Inspection Scanners.Flaw Detectors / Phased Array Flaw Detectors ▾.Thickness and Flaw Inspection Solutions ▾.